Exceptional systems to handle thin warped_MEMS_various critical wafers

 World leading-edge thin wafer handling systems

✪ thin wafer packer_unpacker

✪ thin wafer sorter

✪ thin wafer EFEM/loader

✪ taiko wafer ring remover



 thin wafer packing highlights

            6"/8" or 8"/12" flexibly adapted

            Up to 8 stations for flexibly configuring shipping boxes and packing materials, ie over 3
                kinds of packing  materials can be designed to meet customer's needs

            Enable packing all kinds of thin warped wafer, ultra thin warped wafer, MEMS wafer,
                BGBMwafer,taiko wafer,etc

            Enable identifying various packing materials/seperator as a perfect packer

            Double wafer, cross slotted wafer detected

            No double interleaves packed

            Sorting function(split/merge/transfer) is optionally configurable



 thin wafer unpacking highlights

           6"/8" or 8"/12" flexibly adapted

           Enable unpacking all kinds of thin warped wafer, ultra thin warped wafer, MEMS wafer,
               BGBM wafer, taiko wafer,etc
         
           No wafer breakage by 100% separating interleaf and wafer

 Our Strengths 

 Various critical wafers like thin warped ,ultra thin warped,  MEMS, FOWLP, BGBM, BSM, glass,  stacked ,film frame, taiko wafers can be stresslessly handled

 Max warpage 12mm can be handled

  Thin wafer thickness  down to 30um can be handled

  Prevent the valuable wafers from contamination, breakage, chipping and risky stress by which device reliability risk might be incurred
 
  Diversified end-effectors are tailored ,integrated with automated change-over to meet
           customer's complicated requirements (see the attached video)

  Future upgrade is flexible & affordable for tomorrow's more complex form factors of  wafers

  Reliable high throughput and low COO(cost of ownership)  

  Market-proved solutions by WW tier 1 semiconductor players